Oxidating processes in high temperature
oxygenation of high-silicon aluminum alloy
YANG Fu-liang, YI Dan-qing, LIU Hong, CHEN Zhi-hu
(School of Materials Science and Engineering, Central South University, Changsha 410083, China)
Abstract: In order to fabricate high–silicon aluminum alloy electronic packaging materials, the oxidating processes in high temperature oxygenation was applied to the Al-30Si and Al-40Si high-silicon aluminum alloys which were prepared through extrusion process. Scanning electron microscope, optical microscopy, thermal physical tester and universal material testing machine were used to study the microstructure, density, hermeticity, coefficient of thermal expansion, thermal conductivity and compressive strength. The experimental results indicate that when Al-Si alloy material is oxidated in high temperature oxygenation, the size of the silicon particles increases especially the silicon crystal of
Al-40Si aggregates and grows more obviously, and the density and the hermeticity are improved. The thermal expansioncoefficient of Al-30Si increases slightly, but the oxidation technology has little influence on that of Al-40Si. However, the oxidation technology has remarkable favorable influence on the thermal conductivity and the compression strength. The thermal conductivity of Al-30Si and Al-40Si respectively increases by 16.4% and 23.5%, and the compression strength of Al-30Si and Al-40Si decreases by 26.8% and 20.5%, respectively.
Key word: high-silicon aluminum alloy; electronic packaging; rapid solidification; oxidated in high temperature oxygenation